Process-state management system, management server and control server adapted for the system, method for managing process-states, method for manufacturing a product, and computer program product for the management server Abstract
A process-state management system encompasses: a plurality of production machines; a control server configured to collectively control at least part of the production machines; a management server including a data-linking module configured to link operation-management data of the production machines with corresponding management information transmitted from the control server, respectively, the management server analyze the operation-management data linked with the management information with a common analysis application; and a management database configured to store the operation-management data linked with the management information.
Приложение 6
United States Patent Application
20170004985
Kind Code
A1
NISHI; Shinichi; et al.
January 5, 2017
PRODUCTION SYSTEM FOR PRINTING ELECTRONIC DEVICES
Abstract
An object of the present invention is to provide a printing production line system for an electronic device, the printing production line system that can achieve prevention of defective products caused by dust generated by a printing method and increase electronic device productivity, and a transport chamber provided with a robot transport line 100 in which a self-traveling robot 111, 112 that transports a base material 15 in a sheet-fed manner in a free state travels is provided, a plurality of processing chambers 6 for forming an electronic device on the base material 15 by printing are provided on at least one side of the transport chamber, a base material transfer area 601 that performs loading of the base material 15 to the processing chamber 6 from the self-traveling robot 111, 112 and unloading of the base material to the self-traveling robot 111, 112 from the processing chamber 6 is provided between the transport chamber and each processing chamber 6, the transport chamber and the base material transfer area 601 communicate with each other through an opening 602 in which a one-way air flow moving to the side where the processing chamber 6 is located from the side where the transport chamber is located is formed, and the one-way air flow in the opening 602 is formed by making an adjustment such that the air pressure in the transport chamber becomes higher than the air pressure in the base material transfer area 601.
Приложение 7
United States Patent Application
20180133677
Kind Code
A1
KIM; Ju Hee
May 17, 2018
APPARATUS FOR A MASS PRODUCTION OF MONODISPERSE BIODEGRADEABLE POLYMER-BASED
MICROSPHERES AND A MULTI-CHANNEL FORMING DEVICE INCORPORATABLE THEREIN
Abstract
Provided is an apparatus for a mass production of microspheres and a multichannel forming device incorporatable therein. The apparatus comprises a multi-channel microsphere forming unit, a first source material reservoir containing the first source material and in fluid communication with the plurality of first microchannels, a second source material reservoir containing the second source material and in fluid communication with the plurality of second microchannels, a flow control unit configured to supply a first gas to the first source material reservoir at a first source material flow rate and to supply a second gas to a second source material reservoir at a second source material flow rate and a product reservoir for accommodating the microspheres formed from the multi-channel forming unit.
25
Журнал «Интернаука»
№ 16 (145), часть 2, 2020 г.
Приложение 8
United States Patent Application
20150066592
Kind Code
A1
Ehm; Hans; et al.
March 5, 2015
METHODS OF SEMICONDUCTOR MANUFACTURING AND SUPPLY CHAIN MANAGEMENT SYSTEMS
Abstract
In various embodiments, a method of semiconductor manufacturing is provided. The method may include: gathering information impacting production of semiconductor goods via a computer network platform; gathering information from a social networking platform via an interface of the computer network platform to the social networking platform; modelling at least one agent of a manufacturing entity in carrying out its tasks to manufacture semiconductor goods; and determining manufacturing capacity of the manufacturing entity as a function of at least the gathered information impacting the production of semiconductor goods, the gathered information from the social networking platform and the modelled agent.
Приложение 9
United States Patent Application
20080008837
Kind Code
A1
SHIBA; Yasuhiro; et al.
January 10, 2008
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD FOR HEAT-TREATING SUBSTRATE
Abstract
A substrate coated with a coating solution for an anti-reflective film is placed on a heat treatment plate and is heat-ed. Nitrogen gas flows near the periphery of the heat treatment plate into a heat treatment space. An exhaust outlet is formed in an upper central portion of an inner cover, and the inner cover has an inner wall surface configured in the form of a tapered surface. This produces a smooth flow of nitrogen gas along the tapered surface to smoothly discharge a sublimate produced from the coating solution together with the gas flow outwardly through the exhaust outlet. After the heating process for a predetermined period of time is completed, the cover moves upwardly, and support pins move upwardly to thrust up the substrate from the heat treatment plate, thereby spacing the substrate apart from the heat treatment plate. This gradually decreases the temperature of the substrate. The substrate is placed in a standby condition within a hot plate in this state until the substrate temperature is decreased down to at least a temperature at which the
production of the sublimate from the anti-reflective film after firing stops, and thereafter a transport robot transports the substrate out of the hot plate.
Приложение 10
United States Patent Application
20050264777
Kind Code
A1
Gardner, Steven D.; et al.
December 1, 2005
High speed lithography machine and method
Abstract
A machine and method for high speed production of circuit patterns on silicon wafers or similar substrates may be used for applications including printing Integrated Circuit (IC) packaging patterns onto wafers prior to separating IC
chips. Projection camera(s) simultaneously project image(s) onto substrate(s) carried on an X, Y,.theta. stage. The projection camera(s) may include independent alignment systems, light sources, and control of focus, image placement, image size, and dose. In one embodiment, each camera inlcudes a 6-axis reticle chuck that moves a reticle to correct image-to-substrate overlay errors. In-stage metrology sensors and machine software establish and maintain the correct relationship among the machine's coordinate systems. Thus, two or more projection cameras can print simultaneously even when substrates are slightly misplaced on the X, Y,. theta. stage.
