The steady downscaling of device-feature size combined with a rapid increase in circuit complexity as well as the introduction of new device concepts based on non-silicon-material systems poses great challenges for device and circuit designers. One of the major tasks is the development of new and improved device models needed for accurate device and circuit design. Another task is the development of new circuit-simulation tools to handle very large and complex circuits. This book addresses both these issues with up-to-date reviews written by leading experts in the field.The first three chapters of the book discuss advanced device models both for existing technologies and for new, emerging technologies. Among the topics covered are models for MOSFETs, thin-film transitors (TFTs), and compound semiconductor devices, including GaAs HEMTs and HFETs, heterodimensional devices, quantum-tunneling devices, as well as wide-bandgap devices. Chapters 4 and 5 discuss advanced circuit simulators that hold promise for handling circuits of much higher complexity than what is possible for typical state-of-the-art circuit simulators today.Contents:BSIM3v3 MOSFET Model (W Liu & C Hu)Thin-Film Transitor Modeling (B Iñiguez et al.)Spice Modeling of Compound Semiconductor Devices (B Iñiguez et al.)Beyond Spice: A Review of Modern Analog Circuit Simulation Techniques (T Ytterdal et al.)The Supercomputer Toolkit and Its Applications (J Katzenelson & A Goikhman)Readership: Graduate students, professors and practising engineers in device and circuit design.Key Features:Studies the causes, processes and consequences of transnational movements of people, goods, services, technology and informationLooks at globalization and regionalization as they affect the Asia-Pacific and other regionsProvides wider perspectives or interpretations of the transformation of the Asia-Pacific region by scholars and practitioners of different disciplinary, national, and generational backgrounds